Rogers basic materials

Rogers corporation specializes in design and production of high-frequency basic materials of RT/duroid, Ultralam, TMM and RO series. The main features of such lamellas are low dielectric losses and relative dielectric capacitivity within from 2.3 kHz to 10.2 kHz.

The materials have standard thicknesses and two-or one-sided metallization, made on the basis of electro-deposited/rolled copper, brass or aluminium foil.

Application area

  • Motor and consumer electronics
  • Antennas and high-speed digital equipment
  • Military equipment, modern casing
  • Wireless communication systems

Fluoroplastics RT/duroidXXXX

Composites PTFE reinforced with glass fiber cloth

They are designed as an alternative to PTFE materials (reinforced fluoroplastics). They have low values of anisotropy of dielectric losses and moisture absorption. In addition, this type of RT/duroidXXXX has minimal dielectric permeability among Rogers products. They are used in conditions of high humidity.

PTFE laminates based on ceramics

The features of this type of basic materials are excellent stability of dielectric values, the possibility to apply them in a wide range of temperatures, optimum characteristics of thermal expansion coefficient (similar to CTE of copper). They are applied in aerospace engineering.

Reinforced fluoroplastics ROXXXX

Based on ceramics and PTFE

The basic materials of RO32XX / RO30XX series have excellent microwave electrical characteristics. They are heatproof. They are applied in the production of hybrid assemblies ROXXXX/FR4 and the manufacture of multi-layer printed circuit boards.

The main difference between RO32XX and RO30XX are the combined layers (PTFE/reinforced laminate or PTFE+ceramics) made to increase mechanical strength of the basic material.

Based on ceramics with the addition of thermosetting polymer

RO40XX series has high quality microwave characteristics (an analog of composite materials containing fluoroplastics) and has a simple manufacturing technology combined with the traditional processing of FR4 - reinforced laminated cloth.

RO40XX is made of reinforced glass fiber. The vitrifaction temperature is more than 280 °C. During the production process a layer of thermosetting polymer with ceramics is applied to glass fiber cloth. As a result, this type of basic material does not need additional plasma processing. The series includes fireproof coatings.

RO43XX series is based on a laminated material. The product has high dielectric characteristics (up to 6.15GHz), which, in its turn, allowed to reduce the total area occupied by the surface of the printed circuit board up to 30%. The basic material is heat-resistant and easy to process (it is actively used to make metallized holes).

Reinforced laminated materials Ultralam ХХХХ

Laminated materials are produced on the basis of glass fiber (brand 1080). They have a high reliability. They are used in antennas, wireless communication systems and as ancillary equipment for stationary mobile telephone transmitter units.

TMMXX hydrocarbon ceramics

TMM series (thermally stable high-frequency laminates) is designed on the basis of hydrocarbon ceramics. The features of materials are high rigidity, stability of mechanical/electrical parameters and the possibility to apply them in a significant temperature range. They are used in satellite equipment, flexible printed circuit boards, communication systems and antenna production.

Parameters of Rogers basic materials

 

Parameters

RT/duroid

RO

Ultralam

TMM

Standard thicknesses, mm

0,127-3,175

0,101-1,524

0,101-1,524

0,381-3,175

Typical size, mm

From 170×130 to 1220×640

Density, g/cm3

2,1-3,1

1,8-

2,2

1,78-2,77

Coefficient of thermal conductivity, W/m ∙ K

0,2-0,78

0,5-0,81

0,24

0,7-0,76

Moisture absorption,%

0,015-0,05

<0,1-0,06

0,03

0,04-0,16

Specific surface resistance, MΩ

5∙106-3∙108

103-5,7∙109

4∙107

4∙107-9∙109

Specific volume resistance, MΩ/m

5∙106-2∙107

103-107

2∙107

108-3∙109

Heat coefficient

From -425 to +12

From -280 to +13

-100

From -43 to -10

Dielectric loss angle tangent, GHz

0,009-0,0023

0,0013-0,0027

0,0019

0,002-0,0023

Dielectric permeability, GHz

2,2-10,2

3-10,2

2,4-2,6

3,27-9,8

 

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