Thanks to optimal combination of price and technical possibilities of the interconnection step the majority of high-volume items which enjoy mass demand are produced on the basis of double sided PCBs.
The world demonstrates a tendency to reduction of interconnection step of components due to miniaturization of electronic devices. But in cases when the manufacturer does not
have substantial requirements to the PCBs because of relaxed operation conditions and insignificance of size the optimal choice regarding price and technical characteristics will be a single layer PCB. This is true for the majority of manufacturers of high-volume items enjoying mass demand.