The basic materials are a dielectric plate laminated with copper foil. Essentially, these materials are an integral structure of compounds which have different chemical and physical parameters. Substances-compounds can be either foiled from one or both sides or not foiled.
Organic basic materials consist of a base and some binding compound. They have a low dielectric constant, an insignificant angle tangent of the dielectric loss. Their price is available. They are used in household, industrial (specialized) equipment.
Types of organic materials base:
Basic inorganic materials have significant factors of heat conduction, resistance to temperature fluctuations. At the same time the coefficient factors of the thermal expansion are close to zero or negative. They are used as components capable of operating under harsh operating conditions. Types:
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