Basic Material: Aluminium
Aluminium base (Al base) is a high-tech compound designed for the production of printed circuit boards and components with high heat release rates. In addition, the material Al base has high strength characteristics and withstands significant mechanical and vibration loads.
Aluminium is produced in the form of sheets separated by copper. Essentially the basic material is a one-sided printed circuit board which is pasted to an aluminium plate.
Application area
- LED-based lighting equipment: lamps, searchlights and tapes, garlands and flashlights
- Automobile electronics
- Voltage converters and power supplies
- Communication devices
Nuances of aluminium -based printed circuit boards
The boards are made on oxidized aluminium sheets with a copper foil pasted over it. The feature: there is no possibility to make transition vias - such PCB are single-layer.
The boards are processed by chemical methods. As a basis an elastic aluminium alloy (5052) alloyed with chromium and magnesium is used in the percentage content 0.15-0.35% and 2.2-2.8%, respectively. Foil fiberglass, pre-impregnated with epoxy resin, is used as a bondply (dielectric layer). The heat conduction of the entire printed circuit board is from 0.8-10 W/m∙K.
Technological features of the basic material
The heat generated from the components passes quickly through the dielectric plate and it is easily dissipated over the reliably pasted radiator - an aluminium base.
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Parameters |
ChaoShun [CCAF-01] |
ChaoShun [CCAF-04] |
ChaoShun [CCAF-05] |
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Thickness: of aluminium base, mm |
1,5 |
0,8-2 |
|
|
of copper layer, μm |
18, 35, 70 |
35 |
18, 35, 70 |
|
of dielectric, μm |
70 |
80 |
60-200 |
|
Inflammability |
FV-O |
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Glass transition temperature, ˚С |
125 |
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Volume resistivity, Mω/m /m |
4∙108 |
108 |
4,2∙108 |
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Specific surface resistance, Mω/m |
5∙107 |
3,68∙107 |
|
|
Index of the dielectric constant |
4,2 |
4,2 |
4,24 |
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Temperature resistance, ˚С/W |
1 |
0,65 |
0,45 |
|
Index of thermal resistance at soldering 288 ° C, 2 minutes |
There is no blistering defect |
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Bow/Torsion, % |
0,8 |
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Moisture absorption, % |
0,061 |
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Coefficient of heat conduction, W/mm ∙ K |
1 |
1,5 |
2,2 |
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Dielectric breakdown, KW |
2,2 |
2,5 |
4,8 |
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Tearing strength, N/mm |
2 |
1,9 |
1,08 |
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Dielectric loss angle tangent, MHz |
0,02 |
0,029 |
0,033 |
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Sheet size, mm |
From 300×500, to 1220×640 |
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Operational temperature of the protective coating, ˚С |
From 80 |
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Copyright: Sai Fon LLC
